Branded L-TOGL and measuring 9.9 x 11.8 x 2.3mm (right), the AEC-Q101-capable package is designed for up to 175°C, 100V, 400A, 750W, with minimum mosfet device Rds(on) around 300μΩ.
This compares with 250A, 372W and ~740μΩ from the company’s existing 100V, 175°C 10 x 13 x 3.5mm TO-220SMW surface-mount package (left).
To cut electrical and thermal resistance, inside Toshiba has moved away from a soldered lap joint (‘post’ construction) between source metal and package legs in favour of a copper clip, and has thickened internal conductors generally.
