In May, Intel announced a $3.5 billion investment into its Rio Rancho packaging facility in Albuquerque, New Mexico.
Intel has emphasised that advances in a new generation of packaging technology are one of its planks in its target to take industry leadership in manufacturing by 2025.
The new packaging generation – called copper hybrid bonding interconnect – takes over when bump dimensions get to below 10 micron and it delivers a 10x improvement in interconnect density.
