In late February, the Department plans to release a Notice of Funding Opportunity for commercial leading-edge, current, and mature node fabrication facilities.
This includes both front-end semiconductor manufacturers and back-end packaging facilities.
In late spring, the Department plans to release another funding announcement focused on material suppliers and equipment manufacturers.
In early fall, the Department plans to announce a funding opportunity to support the construction of semiconductor R&D facilities that will further strengthen the U.S. semiconductor manufacturing ecosystem.
