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US DoC sets out stages for spending Chips Act money

February 9, 2023


In late February, the Department plans to release a Notice of Funding Opportunity for commercial leading-edge, current, and mature node fabrication facilities.

This includes both front-end semiconductor manufacturers and back-end packaging facilities.

In late spring, the Department plans to release another funding announcement focused on material suppliers and equipment manufacturers.

In early fall, the Department plans to announce a funding opportunity to support the construction of semiconductor R&D facilities that will further strengthen the U.S. semiconductor manufacturing ecosystem.

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