The nodes are 7nm, 4nm, 3nm, 20A and 18A.
The head of Intel’s process development, evp Dr Anne Kelkeher, says Intel has delivered to a customer a test chip made on 18A – the most advanced of the processes – and expects two 18A tape-outs in 2022, four 18A test chips in 2023 and the introduction of the process in 2024. The process was originally scheduled for 2025.
Earlier this year the 7nm process went into production, the 4nm process, which will see Intel’s first use of EUV, is due in H2 2022 and the 3nm process is scheduled for H1 2023.
