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Toshiba shrinks solid-state lidar for transport infrastructure

A key improvement is within the silicon photo-multiplier (SiPM) light receiving integrated circuits which have light-receiving cells controlled by transistors.

The new chips have smaller transistor modules, replace buffer layers protecting the transistors with newly-developed insulating trenches between the transistors and the light-receiving cells (diagram right).

To recover sensitivity lost in using smaller transistors, a high-withstand voltage section has been added to raise the voltage input to the light-receivers.

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