“Within a decade, we envision that America will both manufacture and package the world’s most sophisticated chips,” says Laurie Locascio director of the US National Institute of Standards and Technology (NIST), “this means both onshoring a high-volume advanced packaging industry that is self-sustaining, profitable and environmentally sound, and conducting the research to accelerate new packaging approaches to market.”
“The Vision for the National Advanced Packaging Manufacturing Program” (NAPMP), details the vision, mission and objectives for the advanced packaging program created by the Chips Act.
